Classes ended on the 19th and students have left for winter break, but things have remained busy here at SOM over the holidays. First, leading up to the break, the school hosted the 58th annual Yale CEO Summit in New York. Organized by Senior Associate Dean Jeffrey Sonnenfeld, the CEO Summit is an opportunity for chief executives of top organizations to have candid, off-the-record conversations about the challenges facing contemporary business. It is also an opportunity to recognize exemplary leaders through the Legend in Leadership Award, the recipients of which this year were Jamie Dimon of JPMorgan Chase and Ivan Seidenberg of Verizon.
More recently, the school was profiled in a New York Times article devoted to an SOM hedge fund elective. The class, run by Leon Metzger, a practitioner with almost 20 years of hedge fund experience, requires students to devise and pitch a hedge fund to a panel of actual hedge fund executives. It's one example of the ways in which SOM uses industry experts and real-world assignments to complement its curriculum and impart practical skills to its students.Moreover, despite the break, next week is a busy one for some students, as investment banks, other finance organizations, and consulting firms come to campus for the annual "SuperWeek" internship interviews. Then, the following Monday, first-year students head to locations around the world for their 10-day International Experience trips, before returning to New Haven for the start of classes on January 26. Between SuperWeek, the International Experience, and spring semester classes and events, there will certainly be a lot happening in the next few months at SOM.And of course, throughout this period, the Admissions Office continues to be busy working through Round 1 applications and preparing for the upcoming January 7 Round 2 deadline. At this point, we have extended the vast majority of Round 1 interview invitations, but may extend a handful more starting next week and as we run up to the Round 1 decision deadline of January 16.